Foxconn Off Campus Drive 2026 | Entry Level | Failure Analysis Engineer | Diploma/ BE/ B.Tech – ECE, EEE, ICE | 2018 – 2024 Batch | Bangalore
Company: Foxconn Hon Hai Technology India
Foxconn Off Campus Drive 2026: Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) is the worlds largest electronics manufacturer. Foxconn is also the leading technological solution provider, and it continuously leverages its expertise in software and hardware to integrate its unique manufacturing systems with emerging technologies.
Foxconn Technology Group was ranked 24th among Fortune Global 100, 105th among Forbes Global 2000, 8th among Forbes Top Multinational Performers, and 215th among Forbes World’s Best Employers.
Company Website: www.foxconn.com
Positions: Failure Analysis Engineer
Role: Application Engineer
Job Location: Bangalore
Salary: INR 3 -4.5 LPA
Experience: 1 – 6 Years
Eligibility Criteria for Foxconn Off Campus Drive 2026:
- Diploma or Bachelors degree in Electronics, Electrical, Instrumentation, or related field.
- 1- 6 years of experience in Failure Analysis, testing, or electronics diagnostics.
- Strong analytical mindset with problem-solving capabilities.
- Proficiency with FA lab tools and testing instruments.
- Ability to interpret technical data and prepare detailed reports.
- Good communication skills and ability to work in cross-functional teams.
Job Description:
Foxconn Hon Hai Technology India Mega Development Pvt. Ltd. is conducting an off-campus hiring drive to onboard experienced engineers across various functions for its Bengaluru facility. This role offers an excellent opportunity to work with cutting-edge technologies in a fast-paced, high-performance manufacturing environment.
Job Overview
We are seeking a highly skilled Failure Analysis Engineer responsible for investigating product failures, identifying root causes, and supporting continuous improvement initiatives. The ideal candidate should have strong analytical abilities, hands-on experience with FA tools, and proficiency in data interpretation and troubleshooting.
Key Responsibilities:
Failure Analysis
- Diagnose and troubleshoot product and component-level failures.
- Identify underlying failure mechanisms through systematic investigation.
- Perform Root Cause Analysis (RCA) and provide corrective action recommendations.
Data Analysis
- Analyze complex data sets to identify patterns, anomalies, and failure trends.
- Convert analytical findings into actionable insights and clear reports.
FA Tool Operation
Hands-on experience operating:
- Microscopes (optical/digital)
- Multimeters
- Oscilloscopes
- SEM (Scanning Electron Microscopy)
- Acoustic tools (e.g., SAT/ Ultrasonic inspection)
Programming
- Working knowledge of Python for data analysis, automation, or report generation.
How to Apply for Foxconn Off Campus Drive 2026?
Interested and eligible candidates can apply drive by following the link as soon as possible.
Apply Link: Click Here
